tag: OSATs

Who Is Most Likely To Link Financial And Manufacturing Data?
By Anne Meixner - 08 May, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss which companies have the most to gain from linking financial data with manufacturing data analytics platforms with Dieter Rathei, CEO of DR Yield; Jon Holt, senior director of product management at PDF Solutions, Alex Burlak, vice president of advanced analytics and test at proteanTecs; and Dirk de Vries, technical program ma... » read more

Back-End Packaging And Test: From Lessons Learned To Future Innovations
By Jessica Albright - 20 Feb, 2025 - Comments: 0

The semiconductor industry is a hallmark of technological innovation, evolving rapidly to meet the demands of an increasingly digital world. At its core, semiconductor manufacturing involves two main stages: front-end processes, (wafer fabrication) and back-end processes (packaging and test). Wafer fabrication consists of creating microscopic electronic circuits on a silicon wafer. Packaging an... » read more

Advanced Packaging Evolution: Chiplet And Silicon Photonics-CPO
By Vincent Lin - 20 Feb, 2025 - Comments: 0

As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing the advancements of any single semiconductor technology. This shift underscores the importance of heterogeneous integration (HI) as a crucial solution for alleviating bandwidth bottlenecks. Tod... » read more

Assembly Design Rules Slowly Emerge
By Bryon Moyer - 27 Jan, 2025 - Comments: 0

Process design kits (PDKs) play an essential in ensuring that silicon technology can proceed from one generation to the next in a manner that design tools can keep up with. No such infrastructure has been needed for packaging in the past, but that's beginning to change with advanced packages. Heterogeneous assemblies are still ramping up, but their benefits are attracting new designs. “Chi... » read more

Advanced Packaging Driving New Collaboration Across Supply Chain
By Gregory Haley - 24 Oct, 2024 - Comments: 0

The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and extraordinarily complex problems. At the heart of this change is the convergence of heterogeneous integration, chiplets, and 3D stacking. Heterogeneous approaches allow companies to combine different te... » read more

Why Small Fab And Assembly Houses Are Thriving
By Bryon Moyer - 15 Aug, 2024 - Comments: 0

High-volume products get more than their fair share of attention in the semiconductor world, but most chips don't fit into that category. While a few huge fabs and offshore assembly and test (OSAT) houses process enormous volumes of chips, small fabs and packaging lines serve for lower volumes, specialized technology, and prototyping. “There are companies that run literally one lot of 25 w... » read more

What Works Best For Chiplets
By Anne Meixner - 18 Apr, 2024 - Comments: 0

The semiconductor industry is preparing for the migration from proprietary chiplet-based systems to a more open chiplet ecosystem, in which chiplets fabricated by different companies of various technologies and device nodes can be integrated in a single package with acceptable yield. To make this work as expected, the chip industry will have to solve a variety of well-documented technical an... » read more

Fan-Out Panel-Level Packaging Hurdles
By Anne Meixner - 24 Jan, 2024 - Comments: 0

Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution layers (RDLs) formation can be scaled up with equivalent yield. There is still much work to be done before that happens. Until now, FOPLP has been adopted for devices that are manufactured in ve... » read more

Many More Hurdles In Heterogeneous Integration
By Laura Peters - 18 Jan, 2024 - Comments: 0

Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where many new and familiar problems need to be addressed. The industry’s first foray into fine-pitch multi-die packaging utilized silicon interposers with through-silicon vias (TSVs) to deliver s... » read more

Smart Manufacturing Makes Gains In Chip Industry
By Anne Meixner - 15 Jun, 2023 - Comments: 0

Lights out manufacturing is gaining steam across the semiconductor industry, accelerating productivity, improving quality, and reducing costs and environment impact. These benefits are the result of years of strategic investments in technologies like machine-to-machine communication, data analytics, and robotics to achieve higher levels of autonomy. Semiconductor factories have long depen... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy
OSZAR »