Author's Latest Posts

Patterned MW-NSFETs For Sustainable Scaling (POSTECH)
By Technical Paper Link - 28 Jun, 2025 - Comments: 0

A new technical paper titled "Patterned Multi-Wall Nanosheet FETs for Sustainable Scaling: Zero Gate Extension With Minimal Gate Cut Width" was published by researchers at POSTECH. Abstract "In nanosheet field-effect transistors (NSFETs), the scaling of the cell height (CH) is constrained by strict design rules related to gate extension (GE), gate cut (GC), and device-to-device distance. ... » read more

Viability of aZnMIm As A Resist For EUV Lithography (Johns Hopkins, Northwestern, Intel et al.)
By Technical Paper Link - 27 Jun, 2025 - Comments: 0

A new technical paper (preprint) titled "Extreme Ultraviolet and Beyond Extreme Ultraviolet Lithography using Amorphous Zeolitic Imidazolate Resists Deposited by Atomic/Molecular Layer Deposition" was published by researchers at Johns Hopkins University, Northwestern University, Intel Corporation, Bruker Nano, EUV Tech and Lawrence Berkeley National Lab. The paper states "This study demonstr... » read more

GNN-Based Framework for Hardware Trojan Detection, Including RISC-V Cores
By Technical Paper Link - 26 Jun, 2025 - Comments: 0

A new technical paper titled "TROJAN-GUARD: Hardware Trojans Detection Using GNN in RTL Designs" was published by researchers at University of Connecticut and University of Minnesota. Abstract "hip manufacturing is a complex process, and to achieve a faster time to market, an increasing number of untrusted third-party tools and designs from around the world are being utilized. The use of th... » read more

HW Security: Multi-Agent AI Assistant Leveraging LLMs To Automate Key Stages of SoC Security Verification (U. of Florida)
By Technical Paper Link - 25 Jun, 2025 - Comments: 0

A new technical paper titled "SV-LLM: An Agentic Approach for SoC Security Verification using Large Language Models" was published by researchers at University of Florida. Abstract "Ensuring the security of complex system-on-chips (SoCs) designs is a critical imperative, yet traditional verification techniques struggle to keep pace due to significant challenges in automation, scalability, c... » read more

Device Architecture For 2D Material-Based mNS-FETs In Sub-1nm Nodes (Sungkyunkwan Univ., Alsemy)
By Technical Paper Link - 24 Jun, 2025 - Comments: 0

A new technical paper titled "Exploring optimal TMDC multi-channel GAA-FET architectures at sub-1nm nodes" was published by researchers at Sungkyunkwan University and Alsemy Inc. "This paper explores the design and optimization of multi-Nanosheet Field-Effect Transistors (mNS-FETs) employing a Transition Metal Dichalcogenide (TMDC) channel, specifically MoS2, for the 0.7 nm technology node u... » read more

Wafer Bonding Mechanisms Using SiCN Films For Hybrid Bonding Applications In 3D Integration 
By Technical Paper Link - 24 Jun, 2025 - Comments: 0

A new technical paper titled "Material-Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration" was published by researchers at Yokohama National University, TEL, SK hynix, and University of Tsukuba. According to the paper: "Although much research has been conducted on wafer bonding methods compatible with the latest semiconductor manufacturing processes, discussions on the interface... » read more

Platform for LN-Based Wavelength-Scale Integrated Phononic Waveguides On Diamond (Stanford, UCSB)
By Technical Paper Link - 24 Jun, 2025 - Comments: 0

A new technical paper titled "Integrated phononic waveguide on thin-film lithium niobate on diamond" was published by researchers at Stanford University and UC Santa Barbara. Abstract "We demonstrate wavelength-scale phononic waveguides formed by transfer-printed thin-film lithium niobate (LN) on bulk diamond (LNOD), a material stack that combines the strong piezoelectricity of LN with the ... » read more

Analytical Methods For Analyzing PFAS In Semiconductor Wastewater (Oregon State University)
By Technical Paper Link - 24 Jun, 2025 - Comments: 0

A new technical paper titled "Practical Guidance on Selecting Analytical Methods for PFAS in Semiconductor Manufacturing Wastewater" was published by researchers at Oregon State University, Corvallis. Abstract "The focus of this review is to provide an overview of the nomenclature, structure, and properties of perfluoroalkyl and polyfluoroalkyl substances (PFAS) that dictate the selection o... » read more

Machine Intelligence on Wireless Edge Networks with RF Analog Architecture (MIT, Duke)
By Technical Paper Link - 21 Jun, 2025 - Comments: 0

A new technical paper titled "Machine Intelligence on Wireless Edge Networks" was published by researchers at MIT and Duke University. Abstract "Deep neural network (DNN) inference on power-constrained edge devices is bottlenecked by costly weight storage and data movement. We introduce MIWEN, a radio-frequency (RF) analog architecture that "disaggregates" memory by streaming weights wirele... » read more

Domain Adaptation for Image Classification of Defects in Semiconductor Manufacturing (Infineon, U. Padova et al.)
By Technical Paper Link - 21 Jun, 2025 - Comments: 0

A new technical paper titled "Domain Adaptation for Image Classification of Defects in Semiconductor Manufacturing" was published by researchers at Infineon Technologies, University of Padova and University of Bologna. Abstract "In the semiconductor sector, due to high demand but also strong and increasing competition, time to market and quality are key factors in securing significant marke... » read more

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